OS GSO IEC 61188-5-1:2014
IEC 61188-5-1:2002
Omani Standard
Current Edition
·
Approved on
25 December 2014
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
OS GSO IEC 61188-5-1:2014 Files
English
141 Pages
Current Edition
Reference Language
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OS GSO IEC 61188-5-1:2014 Scope
This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
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